Mechanics of Solder Alloy Interconnects

As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electronic p... » 

As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electronic packages. The authors discuss the basic metallurgy of solder alloys, the constitutive models available for modeling solder interconnects, com «