Book
Layer Formation and Thermal Performance
Gel Thermal Interfaces and Underfills - Basic Experimental and Modeling Techniques Applied to Contemporary Problems in Electronics Packaging «
Score:
Reviews:
Times tipped:
Times read:
Author(s):
Category:
ISBN
9783639437034
Welcome to Boeklezers.nl
Boeklezers.nl is a network for social reading. We help readers discover new books and authors, and bring readers in contact with each other and with writers. Read more ».
Nobody
