Chemical Mechanical Planarization Of Microelectronic Materials

This text explains how to use the chemical mechanical planarization (CMP) process to improve the electronic properties of such substances as oxide, tungsten, al... » 

This text explains how to use the chemical mechanical planarization (CMP) process to improve the electronic properties of such substances as oxide, tungsten, aluminum, copper and polysilicon which are used in the microelectronics industry. «