Michael Pecht

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Michael Pecht

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Books

Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties
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Encapsulation Technologies For Electronic Applications
Encapsulation Technologies For Electronic Applications
Offers a comprehensive discussion of encapsulants in electronic applications.This work emphasizes on the encapsulation of microelectronic devices. Itdiscusse... »
 
 
 
 
 

Product Reliability, Maintainability, and Supportability Handbook
Product Reliability, Maintainability, and Supportability Handbook
Helps professionals to identify the shortcomings in the reliability »
 
 
 
 
 

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
A Focus on Reliability »
 
 
 
 
 

China''s Electronics Industry
China''s Electronics Industry
the Definitive Guide for Companies and Policy Makers with Interest in China »
 
 
 
 
 

Quality Conformance And Qualification Of Microelectronic Packages And Interconnects
Quality Conformance And Qualification Of Microelectronic Packages And Interconnects
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Handbook Of Electronic Package Design
Handbook Of Electronic Package Design
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Advanced Routing of Electronic Modules
Advanced Routing of Electronic Modules
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China's Electronics Industry
China's Electronics Industry
The Definitive Guide for Companies and Policy Makers with Interest in China »
 
 
 
 
 

Placement And Routing Of Electronic Modules
Placement And Routing Of Electronic Modules
 »
 
 
 
 
 

 
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